Sep
25

MNE 2023

Meet Oxford Instruments at the 49th International Conference on Micro & Nano Engineering 2023

Micro and Nano Engineering (MNE 2023) is one of the most important international conferences dedicated to micro- and nano-fabrication industry focusing on manufacturing techniques, as well as applications of the fabricated micro/nanostructures, devices, and microsystems into electronics, photonics, energy, environment, chemistry and life sciences.

Oxford Instruments Plasma Technology team is looking forward to welcoming you to Berlin to discuss your current projects and workflows. If you would like to book a meeting with us during the event, please complete the form below.

During MNE 2023 our team will give talks on the below subjects.

Location

Berlin, Germany

Date

25-28 September 2023

Booth Number

Oxford Instruments Booth

Business

Plasma Technology

Event Website

Meet the Presenters

Sarah Riazimehr
Sarah Riazimehr

Dr Sarah Riazimehr

Tuesday, 26 September 2023 at 3:45 pm - 4:00 pm 
(Track1 - Novel Developments in Nano/Micro Fabrication Methods and Processes, Venue - MOA12)

Talk Title: Damage-free Plasma-assisted Atomic Layer Deposition of High-quality Dielectrics on 2D Materials

In this work, we developed a process to deposit dielectrics on graphene through an in-situ-prepared protective layer, using the Oxford Instruments AtomfabTM plasma ALD system.

Dr Sarah Riazimehr is a researcher in residence hired by Oxford Instruments and based at AMO GmbH. She runs Oxford Instruments activities within the 2D Experimental Pilot Line (2DEPL) project. Her main goal is to develop processes to deposit dielectric on 2D materials using Oxford Instruments Atomfab plasma ALD system without inducing any damage on the 2D materials.


Arjun Moothedath
Arjun Moothedath

Arjun Moothedath 

Tuesday, 26 September 2023 at 4:15 pm - 6:30 pm
(Poster Session1.1: Focus Track/Track1/Track3, Venue - MOA10/11)


Talk 
Title: Nonlinear parameter-evolution approach for achieving high aspect ratio in nanoscale etching

Silicon-based periodic nanoscale structures can confine light in compact space, allowing for a high density of integrated optical components through band gap (effective refractive index) engineering. The critical dimension and profile of these high aspect ratio structures are essential to optical performance. This paper reports a nonlinear parameter evaluation with an exponential function for the nanoscale etching.

Arjun Moothedath
is an Application Engineer (Etch) at Oxford Instruments Plasma Technology, UK. With a background in Electronics and Communication Engineering, he specializes in silicon-based process development. Currently, his main focus is on developing the Bosch silicon etching process using the PlasmaPro 100 Estrelas Deep Reactive Ion Etch (DRIE) tools.


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